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Silicone, epoxy, polyurethane, and other materials are used in potting compounds, and their properties are compared.
2025-07-21
1. Epoxy resin glue: Mostly hard, with a few soft ones. The biggest advantage is good adhesion to hard materials, it cannot be opened after potting, high hardness, good insulation performance, ordinary temperature resistance is around 100, and the temperature resistance of heat-cured ones is around 150 degrees, and there are also ones with temperature resistance above 300 degrees, but the price is very expensive, and mass production is generally not feasible. Poor repairability.
2. Organosilicon resin potting glue: Mostly soft after curing, poor adhesion; Advantages: high and low temperature resistance, can be used at 250 degrees for a long time, heat-cured type has higher temperature resistance, better insulation performance than epoxy resin, can withstand more than 10000V voltage, moderate price, good repairability.
3. Polyurethane potting glue: The adhesion is between epoxy and organosilicon, the temperature resistance is generally not more than 100 degrees, there are many bubbles, vacuum pouring is required. Advantages: good low-temperature performance
In recent years, with the rapid development of electrical products, electronic manufacturers have been using various materials for potting electrical products to solve the problems of waterproof, moisture-proof, insulation, and confidentiality. Currently, epoxy resin, organosilicon, polyurethane (PU), and hot melt adhesive are widely used. This section only briefly introduces the characteristics of the above materials for reference by electrical engineers.
Cost:
Organosilicon resin > Epoxy resin > Polyurethane > Hot melt adhesive;
Note: In organosilicon resin, the cost of condensation type is close to that of epoxy resin, and the modified epoxy resin is also close to PU;
Processability:
Epoxy resin > Organosilicon resin > Hot melt adhesive > Polyurethane;
Note: Because of its hydrophilicity, PU must be vacuum-dried to obtain a better cured product. If vacuum and drying are not required, the cost is too high. Therefore, although hot melt adhesive is heated and dissolved for pouring, its operability is still much simpler than that of PU;
Electrical performance:
Epoxy resin > Organosilicon resin > Polyurethane > Hot melt adhesive;
Note: Some addition-type organosilicon or paraffin-type hot melt adhesives have even higher electrical characteristics than epoxy, such as surface resistivity;
Heat resistance:
Organosilicon resin > Epoxy resin > Polyurethane > Hot melt adhesive;
Note: The heat resistance of inexpensive PU is not much better than that of hot melt adhesive;
Cold resistance:
Organosilicon resin > Polyurethane > Epoxy resin > Hot melt adhesive;
Note: Many hot melt adhesives also have very good low-temperature characteristics, so in many cases, epoxy is the last one;
After the liquid chemical is potted into the electrical product, it solidifies and cures into a solid, thus playing a protective, insulating, sealing, waterproof, and confidential role.
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